This is an OLB integrated line that also supports COF. Fully-automatic operation from ACF application to large LCD panels to TCP temporary bonding and final bonding.
- Compatible with large panels up to 22 inches wide
- In the ACF lamination process, our unique mechanism prevents thermal effects on the next ACF edge.
- In the temporary bonding process, reliable punching for thin COF and high-precision bonding using image recognition are performed.
- In the main bonding process, batch bonding is achieved with a long bar.