Our Products

The equipment is used to array micro solder balls, which serve as electrical signal pathways, on wafers and substrates. High throughput productivity has been succeessfully achived by adopting our unique technology. End products are intended for DC, HPC and 5G related devices.

A wide range of flip chip bonders and die bonders are lined up.(from R＆D to mass production) These bonding machines feature hign accuracy and high throughput for various bonding processes and application such as Photonix, LD and Image sensor.

Elemental technologies have been cultivated since the corporate establishment. These technologies allow us to continuously develop new machines and respond to diverse customer requirements while ensurig safety and realiability.