- High bonding accuracy by aligning chip and substrate visions overlapping in one screen
- Optional Features
– Various types of processes and chips *Standard: TCB process
– Automatic flattening mechanism
– Safety light curtain
– Ultrasonic bonding
Features
Specification
| Substrate size | □10 ~ 100 [mm] |
|---|---|
| Chip size (W x L) | 1 × 1 ~ 30 × 40 [mm] (TCB) |
| Loading | 3 ~ 300 [N] |
| Mounting accuracy | ±5 [μm] |
| Bonding head | Ceramic heater, RT to 450 [℃] |
| Bonding stage | Constant heater, RT to 250[℃] |
| Dimensions (W x D x H) | 1,200 × 1,000 × 1,700 [mm] |
| Weight | Approx. 550 [kg] |
