CB-3000

Bonding
  • Flip Chip Bonder

Features

Mass Production FC Bonder for C4 Process

  1. Dual head structure and calibration unit function for both productivity and high accuracy.
  2. Versatile equipment configuration including auto tool changer and multi-die ejector.
  3. Optimization of main structural parts/suppression of vibration.

Specification

Chip size

□0.4~□35 [mm]

Chip supply method

8,12 [inch] dicing ring

Substrate size

□50~330×220 [mm]

Mounting accuracy

±5 [μm] (3σ)

Cycle time

8,000 [chip/hour]

Power supply

AC200 [V], 50/60 [Hz]

Dimensions (W x D x H)

1,800 x 1,550 x 1,650 [mm]

Weight

Approx. 2,200 [kg]

Contact

If you have any questions, please feel free to contact us.

TEL :0266-53-3369

Contact now