- BGA ball mounter for specific package shapes.
- Supports sockets and other special-shaped individual packages
- Machine design minimizes ball usage.
- Alignment of individual packages on carriers by external positioning.
- Reliable detection of errors after ball placement by inspection camera.
- Can be connected to pre- and post-processing equipment to meet customer processes.
Features
Specification
| Singlated substrate size | □30［mm］~ □80［mm] |
|---|---|
| Ball dia. | φ0.3 ~ φ0.76 [mm] |
| Min. ball pitch | 0.5 [mm] (φ0.3 [mm] ball) |
| Dimensions (W x D x H) | 3,270 x 1,550 x 1,750 [mm] |
| Weight | Approx. 2,600 [kg] |
