Ball mounter
  • Substate


  1. BGA ball mounter for specific package shapes.
  2. Supports sockets and other special-shaped individual packages
  3. Machine design minimizes ball usage.
  4. Alignment of individual packages on carriers by external positioning.
  5. Reliable detection of errors after ball placement by inspection camera.
  6. Can be connected to pre- and post-processing equipment to meet customer processes.


Singlated substrate size

□30[mm]~ □80[mm]

Ball dia.

φ0.3 ~ φ0.76 [mm]

Min. ball pitch

0.5 [mm] (φ0.3 [mm] ball)

Dimensions (W x D x H)

3,270 x 1,550 x 1,750 [mm]


Approx. 2,600 [kg]


If you have any questions, please feel free to contact us.

TEL :0266-53-3369

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