- BGA ball mounter for both strip and singlated substrate types.
- Compatible with small-diameter solder balls.
- Reliable detection of errors after ball placement by inspection camera.
- Can be connected to pre- and post-process equipment in accordance with customer processes.
Features
Specification
| Strip substrate size (W x L) | 27 x 150 ~ 100 x 270 [mm] |
|---|---|
| Ball dia. | φ0.15 ~ φ0.6 [mm] |
| Min. ball pitch | 0.3 [mm] (φ0.15 [mm] ball) |
| Dimensions (W x D x H) | 3,790 x 1,300 x 1,650 [mm] |
| Weight | Approx. 2,700 [kg] |
