BM-1700

Ball mounter
  • Substrate

Features

  1. BGA ball mounter for both strip and singlated substrate types.
  2. Compatible with small-diameter solder balls.
  3. Reliable detection of errors after ball placement by inspection camera.
  4. Can be connected to pre- and post-process equipment in accordance with customer processes.

Specification

Strip substrate size (W x L)

27 x 150 ~ 100 x 270 [mm]

Ball dia.

φ0.15 ~ φ0.6 [mm]

Min. ball pitch

0.3 [mm] (φ0.15 [mm] ball)

Dimensions (W x D x H)

3,790 x 1,300 x 1,650 [mm]

Weight

Approx. 2,700 [kg]

Contact

If you have any questions, please feel free to contact us.

TEL :0266-53-3369

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