- In-line micro-ball mounter and inspection/repair system greatly improves productivity.
- Fully automated production from wafer feeding to wafer removal without touching the wafer.
- Parallel processing of each process improves productivity.
- Supports reflow integration in accordance with customer processes
- Compatible with silicon wafers and molded wafers.
- Supports SECS/GEM, OHT, AGV (option)
Features
Specification
| Wafer size | 8, 12 [inch] |
|---|---|
| Ball dia. | φ50 ~ φ300［μm] |
| Min. ball pitch | 90 [μm] (φ50 [μm] ball) |
| Machine alignment accuracy | ±25 [μm] |
| Dimensions (W x D x H) | 9,030 x 2,190 x 1,650 [mm] |
| Weight | Approx. 6,600 [kg] |
| Loader, unloader | Open cassette, FOUP compatible |
