- Achieves mounting cycle time of 2 seconds (*excluding process).
- Ultrasonic bonding enables highly reliable narrow-pitch bonding at low temperatures.
- Both types of chip trays (2 to 4 inches) and wafers (4 to 8 inches) can be supplied.
Features
Specification
| Substrate size (W x L) | 50 × 80 [mm] ~ 80 × 200 [mm] |
|---|---|
| Chip size | 50 × 80 [mm] ~ 80 × 200 [mm] |
| Loading | 10 ~ 200 [N] |
| Mounting accuracy | ±3 [μm] (3σ) |
| Bonding head | Ultrasonic horn (constant heater RT to 250 [℃]) |
| Bonding stage | Constant heater RT to 150 [℃] |
| Dimensions (W x D x H) | 1,320 × 1,800 × 1,780 [mm］*Loader and unloader not included |
| Weight | Approx. 2,400 [kg] |
