- High-speed image processing system and uniquely developed repair unit enable reliable ball repair.
- Image processing system that can keep up with the expansion of C4 area due to the increase in package size.
- Micro-ball inspection and repair system for a wide range of applications from strip to panel-size substrates.
- Compatible with SECS/GEM and AGV (option)
Features
Specification
| Substrate size (W x L) | 60×100 ~ 260×300 [mm] |
|---|---|
| Ball dia. | φ50 ~ φ300 [μm] |
| Min. ball pitch | 90 [μm] (φ50[μm]ball) |
| Machine alignment accuracy | ±15 [μｍ] |
| Dimensions (W x D x H) | 3,065 x 1,700 x 1,650 [mm] |
| Weight | Approx. 3,200 [kg] |
