JP/EN

headerlogo_en

 
 
CBZ1000
CBZ-1000

High-accuracy CoS bonder
for micro chips

Features
特徴
  • 1. Correspond to various methods and packages such as 5G, data communication,
      millimeter wave sensor, photonics, AR field, etc.
  • 2. Metal bonding of the chip (backside metallized product) to the submount (ceramic substrate)
  • 3. High bonding accuracy : ±1 μm
  • 4. Low bonding force : 0.1 ~ 0.3N
  • 5. Correspond to low oxygen concentration (below 500ppm) by gas atmosphere
Specification
基本仕様
  Substrate size (W×L)   □1.0 ~ 5.0[mm] t=0.2 ~ 0.5[mm]
  Chip size (W×L)   0.1×0.3 ~ 0.5×2.0[mm]
  Bonding force   0.1 ~ 3[N]
  Bonding accuracy   ±1[μm](3σ)
  Bonding temperature   Mounting stage RT ~ 450[℃]
   ※TCB head is an option
  Cycle time   8[sec/chip] ※Excluding process time
  Dimensions (W×D×H)   2,100×1,500×1,900[mm]
  Weight   Approx. 2,400 [kg]

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

Click here to send message