JP/EN

headerlogo_en

 
 
CB600
CB-600

Ultra-low load
Flip Chip bonder

Features
特徴
  • 1. Correspond to fine pitch of electrodes with mounting accuracy ± 1μm
  • 2. Correspond yo ultra-low load (0.049N) to high load (490N) without head replacement
  • 3. Follows thermal variation of work and tools in real time
  • 4. Equipped with recipes for various bonding processes as standard
  • 5. Feedback of abnormalities by bonding log analysis
  • 6. Optional function is applicable according to each process, customer needs
    • * Ultrasonic bonding
    • * Gel pack supply
    • * Face up supply
Specification
基本仕様
  Substrate Size (W×L)   □5 ~ 100[mm]×235[mm]
  Chip Size   □1 ~ 20[mm]
  Bonding force   Low load range : 0.049 ~ 4.9[N]
  High load range : 4.9 ~ 490[N]
  Bonding Accuracy   ±1[μm](3σ)
  Bonding Head   Ceramic heater RT ~ 450[℃]
  Bonding Stage   Constant heater RT ~ 250[℃]
  Dimensions (W×D×H)   1,320×1,800×1,780[mm]
  Weight   Approx. 2,500[kg]

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

Click here to send message