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CB505
CB-505

Manual Flip Chip bonder
ideal for low quantity production
and experiments

Features
特徴
  • 1. Extremely high bonding accuracy by aligning chips and substrate on the same screen
  • 2. Option Items
    • (a) Various types of processes and chips   * standard: TCB process
    • (b) Show the graph display of bonding process
         * Display item: Bonding force, temperature, head height
    • (c) Auto levelizer
    • (d) Safety light curtain
Specification
基本仕様
  Substrate Size   □10 ~ 100[mm]
  Chip Size (W×L)   □1 ~ 30[mm]×40[mm](TCB)
  Bonding Force   3 ~ 300[N]
  Bonding accuracy   ±5[μm]
  Bonding Head   Ceramic heater RT ~ 450[℃]
  Bonding Stage   Constant heat method RT ~ 250[℃]
  Dimensions (W×D×H)   1,200×1,000×1,700[mm]
  Weight   Approx 550[kg]

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

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