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CB200
CB-200/210

Ultra space saving
Flip Chip bonder

Features
特徴
  • 1. Space saving design that can be set up on the table
  • 2. Ideal for R&D to small-lot production
  • 3. Optional function is applicable according to each process, customer needs
    • * Ultrasonic bonding
    • * Gel pack supply
    • * Face up supply
Specification
基本仕様
    CB-200   CB-210
  Substrate size (W×L)   □10 ~ 150[mm]×300[mm]
  Chip size   □0.8 ~ 30[mm]
  Bonding force   1 ~ 100[N]
  Bonding accuracy   High accuracy mode : ±2[μm](3σ)
  Normal mode : ±5[μm](3σ)
  Tact time   High accuracy mode : 10[sec/chip]
  Normal mode : 6[sec/chip]
  Stage temperature   RT ~ 50℃   RT ~ 250℃
  Voltage   100[V]   200[V]
  Dimensions (W×D×H)   Body : 702×805×740[mm]
  Control box : 746×350×510[mm]
  Weight   Body : Approx 120[kg]
  Control box : Approx50[kg]

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

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