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CB1810
CB-1810

Ultra-sonic Flip Chip bonder

Features
特徴
  • 1. Achieve mounting tact with 2 seconds (Without process time)
  • 2. Highly reliable narrow pitch bonding at low temperatures is capable
      with Ultra-sonic bonding
  • 3. Supply of both types of chip tray (2~4 inch) and Wafer (4~8 inch) is capable
Specification
基本仕様
  Substrate size (W×L)   50×80[mm] ~ 80×200[mm]
  Chip size   □3 ~ 10[mm]
  Bonding force   10 ~ 200[N]
  Bonding accuracy   ±3[μm](3σ)
  Bonding head   US horn (constant heater RT~250[℃])
  Bonding stage   Constant heater RT~150[℃]
  Dimensions (W×D×H)   1,320×1,800×1,780[mm]
   * Excluding Loader, Unloader
  Weight   Approx. 2,400 [kg]

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

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