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CB1800
CB-1800

Ultra-low load
Flip Chip bonder

Features
特徴
  • 1. Industry's first COF Ultrasonic bonder which correspnds to reel supply
  • 2. Achieve high throughput by utilizing ultra-sonic bonding feature
  • 3. Equipped with an automatic head cleaning mechanism
  • 4. Dispens head can be installed before bonding as an option
Specification
基本仕様
  Tape width   35[mm], 48[mm], 70[mm]
  Chip size   1×10 ~ 4×25[mm]
  Bonding force   10 ~ 200[N]
  Bonding accuracy   ±3[μm](3σ)
  Bonding head   US horn (constant heater RT~250[℃])
  Bonding stage   Constant heater RT~150[℃]
  Dimensions (W×D×H)   2,900×1,500×1,950[mm]
  Weight   Approx. 2,400 [kg]

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

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