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BM2150WI
BM-2150WI

Micro Ball Mounter
In-line system

Features
特徴
  • 1. In-line ball mounting and ball inspection repair, greatly improving productivity
  • 2. Achieve fully automatic production without touching the wafer from feeding to removal
  • 3. Increase productivity by parallel processing of each process
  • 4. Connection with Reflow machine, washing machine is possible according to customer process
  • 5. Silicon wafer and molded wafer are also applicable
  • 6. SECS/GEM, OHT, AGV functions are available as an option
Specification
基本仕様
  Wafer size   8, 12 Inch
  Ball diameter   φ50[μm] ~ φ300[μm]
  Minimum ball pitch   90[μm](φ50[μm]ball)
  Alignment accuracy   ±25[μm]
  Dimensions (W×D×H)   9,030×2,190×1,650[mm]
  Weight   Approx 6,600[kg]
  Loader.Unloader   Open cassette、FOUP

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

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