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BM2000
BM-2000WR/SR

Micro ball
Inspection repair system

Features
特徴
  • 1. High-speed inspection of ball dropout, extra ball, and pitch is capable with two inspection
      cameras
  • 2. Support 2 types of Repair
    • (a) Balldrop: after flux dispensed, ball mounting
    • (b) Extraball: Removing by nozzle suction
  • 3. Equipped with automatic calibration function
  • 4. Wafers (Panels) that use two types of balls with different diameters can be inspected
      and repaired at once. (option)
  • 5. SECS/GEM, OHT, AGV functions are available as an option
Specification
基本仕様
    BM-2000WR   BM-2000SR
  Stage size   8, 12 Inch wafer   MAX□300[mm] Panel
  Ball diameter   φ50[μm] ~ φ300[μm]
  Minimum ball pitch   90[μm](φ50[μm]ball)
  Alignment accuracy   ±15[μm]
  Dimensions (W×D×H)   3,065×1,700×1,650[mm]
  Weight   Approx 2,900[kg]
  Loader, Unloader   Open cassette、FOUP   Customizable

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

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