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BM1400
BM-1400W

Micro Ball Mounter

Features
特徴
  • 1. New generation ball mounter upgarde from previous model by feeding back to voice of
      customer
  • 2. Simple mechanism with single head
  • 3. Flexible layout arrangment to meet customer demand
  • 4. Achievement of minimum consumption of solder ball
  • 5. Improved frame rigidness, achieving higher speed and accuracy
  • 6. Silicon wafer and molded wafer are also applicable
  • 7. SECS/GEM, OHT, AGV functions are available as an option
Specification
基本仕様
  Wafer Size   8, 12 Inch
  Ball diameter   φ40[μm] ~ φ300[μm]
  Minimam ball pitch   80[μm](φ40[μm]ball)
  Alignment accuracy   ±13[μm]
  Dimension size (W×D×H)   3,820×1,700×1,700[mm]
  Weight   Approx 3,700[kg]
  Loader, Unloader   Open cassette、FOUP

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

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