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BM1310
BM-1310W

Micro Ball Mounter

Features
特徴
  • 1. High-speed and stable ball mounting is capable by adopting the unique ball mounting method.
  • 2. Simple structure which enables easy maintenance
  • 3. Silicon wafer and molded wafer are also applicable
  • 4. Achieve high efficiently ball consumption by optimizing ball transfer method
  • 5. SECS/GEM, OHT, AGV functions are available as an option
Specification
基本仕様
  Wafer Size   8, 12 Inch
  Ball diameter   φ50[μm] ~ 300[μm]
  Minimam ball pitch   90[μm] (50[μm]ball)
  Alignment accuracy   ±25[μm]
  Dimension size(W×D×H)   3,595×1,650×1,650[mm]
  Weight   Approx. 2,600[kg]
  Loader, Unloader   Open cassete, FOUP

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

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