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BA1700
BA-1700

Solder ball mounter for BGA

Features
特徴
  • 1. Solder ball mounting machine corresponds to both small-diameter balls
      and strip/singulated substrate
  • 2. Ball mounting: New method of  " Ball transfer + Ball adsorption "
  • 3. Correspond to strip/singulated substrate
  • 4. Inspect with CCD camera after mounting the solder balls, and stored defective substrate
      in the NG magazine
  • 5. Correspond to flux printing(Option)
  • 6. Connection with Reflow machine is possible according to customer process
Specification
基本仕様
  Strip Size (W×L)   27×150 ~ 100×270[mm]
  Singulated Substrate Size   □30[mm] ~ □80[mm]
  (Tray size:Max160×310[mm])
  Ball diameter   φ0.15 ~ φ0.6[mm]
  Minimum ball pitch   0.3[mm](φ0.15[mm]ball)
  Dimensions (W×D×H)   3,790×1,300×1,650[mm]
  Weight   Approx 2,700[kg]

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

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