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BA1420
BA-1420

Solder ball mounter for BGA

Features
特徴
  • 1. Solder ball mounting machine corresponding to unique shaped packages
  • 2. Correspond to sockets and other specially shaped singulated packages
  • 3. Machine design that minimizes ball consumption
  • 4. Align singulated packages on the carrier by external positioning
  • 5. Inspect with CCD camera after mounting the solder balls, and stored defective substrates
      in the NG magazine
  • 6. Connection with front-end process, after ball mounting with Reflow machine is possible
      according to customer process
Specification
基本仕様
  Singulated Substrate Size   □30[mm] ~ □80[mm]
  Ball diameter   φ0.3 ~ φ0.76[mm]
  Minimum ball pitch   0.5[mm](φ0.3[mm]ball)
  Dimensions (W×D×H)   3,270×1,550×1,750[mm]
  Weight   Approx 2,600[kg]

Contact us

otoiawase3
We provide FA equipment that meets customer needs.

TEL +81-266-53-3369  FAX +81-266-58-1755

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