Athlete FA Corporation

Athlete FA Corporation provides variety of factory automation system such as semiconductor assembly equipment.

COMPANY PROFILE

〒392-0012
2970-1 Shiga, Suwa City, Nagano 392-0012, Japan
TEL:0266-53-3369 FAX:0266-58-1755

 

Business Lines

Factory automation engineering Development, design, manufacture, and marketing of high-precision mounting and assembly systems for fields such as office equipment, semiconductors, electronic parts, automobiles, and communications equipment Design, manufacture, and marketing of automation equipment.

 

Semicon China 2018

 

Athlete FA Corporation Japanese Site

 

Technology information

 

Offering for newly process supplier

 

愛立発自動化設備(上海)有限公司

 

HOME»  TOP»  LCD Systems

LCD Systems

LCD which is dramatically growing as a display alternate with CRT is required upsizing, high definition and lower price from users.
Athlete FA can meet their high level requirements.

 

Automatic ACF Attachment System MTB-1100

Automatic ACF Attachment System MTB-1100

 

■Achieves high-precision attachment to PCBs.

ACF (anisotropic conductive film) is widely used with TAB, COG, and COB, in bonding parts which would be difficult to solder.

 

■SPECIFICATIONS

Target components
ACF size1.5 to 3mm
PCB size100 to 300mm(longer dimension)
Drive sources and accuracy(AFC transfer stage)
XY table driveAC servomotor + ball screw
Z axis drive sourceAir cylinder
θaxis drive sourceServo actuator
Mounting accuracy±100μm (length accuracy:±100μm)
Joining section
Heating methodConstant heat application
Heating head temperature250℃ C max.
Applied pressure0.5 to 10kgf
Other specifications
Feed systemPCB:Loaded pallets
ACF:Reels
Image processing systemPattern matching using a gray scale
Air source0.49MPa (5kgf/cm2
Vacuum sourceBuilt-in vacuum generator
Power requirements200VAC,3phase,50/60Hz,6kVA
Outer dimensions1950(W) × 1300(D) × 1700(H)mm
WeightApprox. 1400kg

 

■Features

  1. The reel-feed ACF is halved at the specified position, and transferred to the PCB.
  2. Both 2 and 3-layer ACF is can be accommodated.
  3. Image recognition ensures high-precision mounting.
  4. Both liquid crystal cell and TAB mounting types are available.
  5. Interactive operation from a panel-mounted computer.
  6. Includes a PCB pallet loader/unloader.
  7. Manual type, MTB-120 is lined up.

 

OLB Inline system MTB-2000

OLB Inline system MTB-2000

 

■COF capable OLB Inline system.

MTB-2000 is full automatic OLB Inline system that is capable for ACF attachment, pre bonding and final bonding of TCP to large size LCD. It certainly meet the module assembly demand of the liquid crystal television which will spread increasingly from now on.

 

■SPECIFICATIONS

Target components
Cell size15 to 22 wide inches
ACF width1 to 1.5mm
Tape specifications35mm, 48mm, 70mm
TAB size20 × 7 to 50 × 50mm
Accuracy
Temporary bonding accuracyX:±6μm
Final bonding accuracyX:±8μm
Others
Air source0.49MPa
Vacuum sourceBuilt-in vacuum generator
Power requirements200V AC,3phase,50/60Hz,8kVA × 3
Outer dimensions7530(W) × 1550 (D) × 1950 (H) mm

 

■Features

  1. It is capable for wide panel max. 22 inches
  2. The original19 ACF attachment mechanism prevents the edge of the next ACF from the heat influence.
  3. Certain stamping for thin COF and high precise attachment by image recognition is carried out at pre bonding process.
  4. One time attachment with long bar at final bonding process is realized.

 

Semiautomatic OLB system MTB-200

Semiautomatic OLB system MTB-200

 

■21 inches-capable.Easy operation with visual inspection.

 

■SPECIFICATIONS

Target components
Cell size10 to 21 wide inches
TCP size20 × 7mm to 50 × 50mm
Drive source/Accuracy
XY axis drive sourceAC servomotor + Ball screw
Z axis drive sourceAC servomotor + Ball screw (Temporary bonding head)
Air cylinder (Final bonding head)
θaxis drive sourceAC servomotor actuator (XY table)
Pulse motor (Temporary bonding head)
TCP mounting accuracy±10μm
Temporary mounting head
Heating methodConstant heating method
Heating head temperature250℃ max, 1℃ step
Pressure setting range0.5 to 10kgf
Final bonding head
Heating methodConstant heating method
Heating head temperature300℃ max, 1℃ step
Pressure setting range2.0 to 30kgf
Other Specifications
Air source0.49MPa (5kgf/cm2
Vacuum sourceBuilt-in vacuum generator
Power requirements200VAC,3phase,50/60Hz,8kVA
Outer dimensions1500(W) × 1100(D) × 1700(H)mm
WeightApprox. 1500kg

 

■Features

  1. From 10 to 21 inches panel-capable.
  2. Positioning is only matching target marks on TCP and the panel on the monitor.
  3. By specifying the TCP position on the panel computer, the operation is executed.
  4. It is possible to use the system as an OLB repair system.

 

OLB Inline system MTB-220

OLB Inline system MTB-220

 

■Next generation large size LCD 42 inch is capable.

 

■SPECIFICATIONS

Target components
Cell size14 to 42 wide inches
TCP/COF size15 × 7mm to 65 × 65mm
PWB size950 × 200 × 0.4 to 2mm t max
Accuracy
Final bonding accuracyX:±10μm
Y:±30μm
Others
Air source0.49MPa
Vacuum sourceBuilt-in vacuum generator
Power requirements200V AC,3phase,50/60Hz,6kVA
Outer dimensions2800(W) × 1800 (D) × 1700(H) mm
WeightApprox.1900kg

 

■Features

  1. 14 to 42 inches panel-capable.
  2. Includes an automatic positioning unit by image recognition.

 

OLB/PWB Repair System MTB-500

OLB/PWB Repair System MTB-500

 

■OLB,PWB both repair are capable.

MTB-500 is able to repair OLB and PWB at the same time.

 

■SPECIFICATIONS

Target components
Cell size13 to 21 wide inches
TCP/FPC size20 × 7mm to 50 × 50mm
PWB size450 × 150 × 0.4 to 2t mm max
Drive source/Accuracy
XY axis drive sourceLinear motor
θaxis drive sourceServo actuator
OLB accuracyTCP X:±10μm TCP Y:±30μm
FPC X:±15μm FPC Y:±30μm
PWB accuracyTCP X:±30μm TCP Y:±50μm
FPC X:±50μm FPC Y:±100μm
Others
Air source0.49MPa
Vacuum sourceBuilt-in vacuum generator
Power requirements200V AC,3phase,50/60Hz,8kVA X 3

 

■Features

  1. From 13 to 21 inches panel-capable.
  2. 0Not only TCP but also FPC is capable.
  3. Highly precise attachment is capable by automatic positioning by image recognition.
  4. 3 sides repair-capable
  5. Operation is possible only by specifying the repair position by which it was indicated by the figure on a panel computer.

 

Cell-PCB Semiautomatic Joining System MTB-410

Cell-PCB Semiautomatic Joining System MTB-410

 

■High-accuracy positioning with image recognition and low friction cylinder assure stable pressurization.

Automatic operation except cell and PCB setting. It is able to use as PCB repair system.

 

■SPECIFICATIONS

Target components
Cell size10 to 21 inches
TCP size20 × 7 to 50 × 50mm
Drive source / Accuracy
XY axis drive sourceAC servomotor + ball screw
Z axis drive sourceAir cylinder
θaxis drive sourceAC servomotor actuator
Mounting headX方向::±30μm
Y方向:±50μm
Joining head
Heating methodConstant heating method
Heating head temperature360℃max, 1℃step
Pressure setting range20 to 400N
Others
Image processing methodPattern matching using a gray scale
Air source0.49MPa(5kgf/cm2
Vacuum sourceBuilt-in generator
Power requirements200VAC,3phase,50/60Hz,8kVA
Outer dimensions1600(W) × 1200(D) × 1700(H)mm
WeightApprox. 1500kg

 

■Features

  1. From 10 to 21 inches panel-capable.
  2. Automatic positioning with image recognition.
  3. Executes the operation specifying the joining position on the panel computer.
  4. A able to use as PCB repair system.

 

Semi-auto PWB attachment system MTB-420

Semi-auto PWB attachment system MTB-420

 

■Next generation large size LCD 42 inch is capable.

 

■SPECIFICATIONS

Target components
Cell size14 to 42 wide inches
TCP/COF size15 × 7mm to 65 × 65mm
PWB size950 × 200 × 0.4 to 2t mm max
Accuracy
Final bonding accuracyX:±30μm
Y:±50μm
Others
Air source0.49MPa
Vacuum sourceBuilt-in vacuum generator
Power requirements200V AC,3phase,50/60Hz,6kVA
Outer dimensions2800(W) × 2000 (D) × 1700(H) mm
WeightApprox.2000kg

 

■Features

  1. 14 to 42 inches panel-capable.
  2. Includes an automatic positioning unit by image recognition.

 

Cell-PCB Semiautomatic ACF Attachment System with one time attachment function MTB-410ACF

Cell-PCB Semiautomatic ACF Attachment System with one time attachment function MTB-410ACF

 

■ACF one time attachment function is provided to MTB-410.

Designed for user-friendly operation. Compatible with 23 inch panel.

 

■SPECIFICATIONS

Target components
Cell size8.8 to 23 inches
ACP width1.5 to 2mm
Drive sources and accuracy
XYZθtable driveXY:Linear motor
Z:Air cylinder
θ:Pulse motor
Bonding accuracyX:±30μm
Y:±100μm
Others
Image processing methodPattern matching using a gray scale
Air source0.49MPa (5kgf/cm2
Vacuum sourceBuilt-in generator
Power requirements200VAC,3phase,50/60Hz,6kVA
Outer dimensions1650 (W) ×1450 (D) ×1900 (H) mm
WeightApprox. 1400kg

 

■Features

  1. Operates both ACF one time attachment to PCB and joining to CELL.
  2. Compatible with 23 inch panel.
  3. Both 2 and 3-layer ACF can be accommodated.

 

COG Repair System MTB-600

COG Repair System MTB-600

 

■It is able to repair COG of the large panel.

COG packaging for large LCD panel. MTB-600 is semi-auto COG repair system with user-friendly.

 

■SPECIFICATIONS

Target components
Cell size13 to 21 inches
Chip size10 × 1mm to 25 × 2.5mm
ACP width1.0 to 3.0mm
PWB size450 × 150 × 0.4 to 1.5 t mm max
Accuracy
Temporary bonding accuracy±5μm
Final bonding accuracy±7μ:m
Others
Air source0.49MPa(5kgf/cm2
Vacuum sourceBuilt-in vacuum generator
Power requirements200V AC,3phase,50/60Hz,6kVA
Outer dimensions2350 (W) × 1500 (D) × 1700 (H) mm
WeightApprox. 1800kg

 

■Features

  1. 21inches panel-capable.
  2. Only by specifying the repair position by which it was indicated by the figure on the panel computer, it is carried out from ACF attachment to pre-bonding and final-bonding of a chip automatically.
  3. Highly precise attachment is capable by automatic positioning of image recognition.
  4. The original19 ACF attachment mechanism prevents the edge of the next ACF from the heat influence.

 

Contact

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