Athlete FA Corporation

Athlete FA Corporation provides variety of factory automation system such as semiconductor assembly equipment.

COMPANY PROFILE

〒392-0012
2970-1 Shiga, Suwa City, Nagano 392-0012, Japan
TEL:0266-53-3369 FAX:0266-58-1755

 

Business Lines

Factory automation engineering Development, design, manufacture, and marketing of high-precision mounting and assembly systems for fields such as office equipment, semiconductors, electronic parts, automobiles, and communications equipment Design, manufacture, and marketing of automation equipment.

 

Semicon China 2018

 

Athlete FA Corporation Japanese Site

 

Technology information

 

Offering for newly process supplier

 

愛立発自動化設備(上海)有限公司

 

HOME»  TOP»  Flip Chip Systems

Flip Chip Systems

Flip Chip Bonder CB-600(NEW)

Flip Chip Bonder CB-600

 

■Ultra low load capable flip chip bonder

CB-600 is able to control ultralow load bonding comparing to ordinary flip chip bonding. It realized dramatically reducing damage from loading and stress for bump, aluminum pad, wiring, etc. Also with adjustment function following to thermal shrinkage at cooling process, it achieved high yield and reliability bonding process from preventing crack and break. In addition, this system is enable to proceed ±1μm (3σ) precise accurate bonding, which is very innovative in this field.

 

■Features

  1. Capable for Ultralow load range:0.049~4.9[N](5~500[g]), high load range:4.9~490[N](0.5~50[kg]) without tool exchange.
    ※Not able for loading control across above two range.
  2. Possible for thermal bonding with ceramic heater from room temperature to 450℃.
    ※Room temperature to 250℃ for substrate side.
  3. Able to set and change two kind of tool for different recipe with ATC(Auto tool changer).
  4. Chips are set to chip tray with face down condition. Will be bonded after alignment with visual recognition.

 

Flip Chip Bonder CB-505

Flip Chip Bonder CB-505

 

■Compact, low price, manual type Flip Chip Bonder which is suitable for small lot production and small king of experiment.

CB-505 is possible to exchange to ultrasonic head with option in addition to thermal press bonging by heating with ceramic heater.

 

■Features

  1. Because chip and substrate positioning are proceeded on a single screen, it is possible to achieve high bonding position accuracy, in spite of the use of manual positioning.
  2. CB-505 is designed to select its bonding method not only by the application of pressure or heat, but also by the application of ultla sonic. (As an option)
  3. Two types of pressure loading are provided fixed pressure loading and point pressure loading.
  4. A graph representation of the bonding process can be displayed and stored, together with parameter settings, onto a floppy disk.
  5. TABs and QFPs can also be accommodated by changing tools.

 

Flip Chip Bonder CB-1710

Flip Chip Bonder CB-1710

 

■Mounting accuracy of ±3 μm. Bonding method is not only by the application of pressure or heat, but also by the application of ultra sonic.

The CB-1710 is a semiautomatic flip chip bonder suitable for R&D or small to medium volume production. It can also be used for mass production after process decision.

 

■Features

  1. Auto leveling function is adopted as standard feature, made the manual adjustment of bonding head unnecessary.
  2. In addition to pressure or heat bonding, it is also capable of ultra sonic bonding (As an option)
  3. Accommodates ATC. (Automatic tool changing)

 

Flip Chip Bonder CB-1750

Flip Chip Bonder CB-1750

 

■Full auto Flip Chip Bonder which introduces heating and pressing method and makes mounting multi chips on substrates.

CB-1750 has ATC function which is available to mount multiple chips in addition to auto leveling function with standard equipment. It is possible to construct the most suitable line for mass prodution by mounting chip loader which corresponds to paste transfer mechanism, gelpack, wafer and tray.

 

■Features

  1. Three types of bonding are possible. Solder bumps, conductive resin and ACF.
  2. An auto bump leveling function is available.
  3. By adopting the automatic tool leveling mechanism, the tool and the substrate have a parallel accuracy of less than 5 μm.

 

COF Ultrasonic Bonding System with reel-supply CB-1800

COF Ultrasonic Bonding System with reel-supply CB-1800

 

■COF ultrasonic bonding system capable reel supply, the first in the industry.

It is sure highly efficient IC driver which is essential for highly fine FPD is designated to be less than 30μm pitch in the future. CB-1800 has introduced the ultrasonic bonding process that make both capability of narrow pitch size and high productivity compatible in the early stage. It has realized an overwhelming performance in connection with our potting system which is capable system which is capable of reel to reel and has an overpowering market share.

 

■SPECIFICATIONS

Target components
Tape width35mm , 48mm , 70mm
Tape thicness0.025 to 0.125mm
Bonding pitch2 to 20 PF

 

■Features

  1. It is possible to set dispenser head up with option before bonding process.
  2. Equipped automatic head cleaning meshanism for dispenser head.
  3. In-line configuration with our COF potting system, MS-1890, applicable to under-fill application.

 

Substrate capable Ultrasonic Flip Chip Bonder CB-1810

Substrate capable Ultrasonic Flip Chip Bonder CB-1810

 

■Ultrasonic flip chip bonder to achieve bonding with room temperature.

 

■SPECIFICATIONS

Target components
Substrate size150 × 200 mm MAX
Outer dimentions1300(W) × 1500(D) × 2140(H)mm
Bonding pitchApprox.2400 kg

 

■Features

  1. Mounting tact time 2 second. Achieves less than 3 second including bonding process.
  2. Capable of ultrasonic bonding with room temperature which never damage bonding materials.
  3. Mounting accuracy is less than ±3μm

 

Wafer Flip Chip Bonder System CB-1900

Inline Flip Chip Bonder System CB-2000

 



CB-1900 is the Flip Chip inline production system that is based on CB-600. The board that is carried from the loader, Resign Potting, carried out the local bonding, then stored into the un loader.

 

■SPECIFICATIONS

Target components
Wafer size MAX 12 inch
Chip size 3 to 15mm sq.
Accuracy
Potting accuracy ±25μm
Bonding accuracy ±2μm
Load range 0.5N ~ 490N
Other
Air source 0.49MPa
Vacuum source Built-in vacuum generator
Power requirements 200VAC,3phase,50/60Hz,8kVA × 3
Head temperature  MAX 450℃
Stage temperature MAX 200℃

 

Die Bonder System CB-1850D

FCB-capable ACF Attachment System MTB-1200

 

■Automatically Die Bonder.

Full Auto Die Bonder which introduces heating and pressing method

 

■SPECIFICATIONS

Target components
Wafer size MAX 12 inch
Accuracy
Mounting accuracy ±3 μm
Other specification
Head temperature MAX 450℃
Load range 0.5N ~ 50N

 

Underfilling-capable COB Potting System MS-1820

Underfilling-capable COB Potting System MS-1820

 

■In addition to conventional grab-top potting, the MS-1820 can accommodate underfill potting after flip-chip mounting.

Cutting-edge technologies such as the processing used to correct application positioning in a 3-axis needle-posting calibration system enable not only conventional grab-top potting, but also underfill potting between a flip-chip and the substrate after mouting of the flip-chip.

 

■SPECIFICATIONS

Target components
Substrate (tray) size50 × 120 to 120 × 350 mm
Potting materialSingle-component type
Transport section
Conveyor width50 to 120 mm
Pre/after-heating temperature50 to 150℃
Conveyor speed100 to 200 mm/s
Potting section
XYZ axis drive sourceAC servomotors + ball screws
Package positioning accuracy±20μm
Main heating temperature50 to 150℃
Syringe heating temperature40 to 50℃
Other specifications
Air source0.49MPa (5kgf/cm2
Power requirements200 VAC, 3 phase, 50/60 Hz, 4kVA
Outer dimensions2050(W) × 900(D) × 1700(H) mm
WeightApprox.1000kg

 

■Features

  1. High-precision positioning mechanism accommodates both grab-top and underfill potting.
  2. 3-axis needle position calibration system automatically corrects for needle position skew when a needle is replaced or bent.
  3. Target device data is stored on floppy disks for easy management.
  4. Point ejection and line ejection modes.
  5. Syringe heating, substrate pre-heating, main heating, and after heating are possible.
  6. OPTION
  7. MS-1820ST : Twin head type(Two syringes at one table)
  8. MS-1820D : Dual head type(One syringe at one table)
  9. MS-1820DT : Quadruple head type

 

Twin heads types to double the through-put (MS-1820ST)

■SPECIFICATIONS

Target components
Power requirements200 VAC, 3 phase, 50/60 Hz, 3kVA
Outer dimensions1350(W) × 800(D) × 1650(H) mm
WeightApprox.900 kg

 

Twin dual heads to quadruple the through-put (MS-1820DT)

■SPECIFICATIONS

Target components
Power requirements200 VAC, 3 phase, 50/60 Hz, 10 kVA
Outer dimensions3250(W) × 1660(D) × 1800(H) mm
WeightApprox.2500 kg

 

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