Athlete FA Corporation

Athlete FA Corporation provides variety of factory automation system such as semiconductor assembly equipment.

COMPANY PROFILE

〒392-0012
2970-1 Shiga, Suwa City, Nagano 392-0012, Japan
TEL:0266-53-3369 FAX:0266-58-1755

 

Business Lines

Factory automation engineering Development, design, manufacture, and marketing of high-precision mounting and assembly systems for fields such as office equipment, semiconductors, electronic parts, automobiles, and communications equipment Design, manufacture, and marketing of automation equipment.

 

Semicon China 2018

 

Athlete FA Corporation Japanese Site

 

Technology information

 

Offering for newly process supplier

 

愛立発自動化設備(上海)有限公司

 

HOME»  TOP»  BGA・CSP system

BGA・CSP system

GA/CSP are most popular type of packages used not only for information terminal such as cellular phone and PDA but also for car parts. We have been providing the latest technology to customers from the very early stage of BGA, and specially have confidence in mounting small diameter balls on CSP.

 

CSP-capable BGA Ball Mounting System BM-4000

CSP-capable BGA Ball Mounting System BM-4000

 

■Achieves lump mounting of φ100μm ball to BGA size substrate

Due to original16 ball placement mounting method in the industry, lump mounting on substrate of o100μm balls at 200μm pitch is possible. Moreover, it realizes mounting tact time 8 sec., a productivity which overthrows what has been common sense until now. It is a revolutionary system which incorporates all customers' requests such as to deal with big warpage, large scale cost-down on jigs etc.

 

■SPECIFICATIONS

Target components
Substrate size27-85 (W) × 150-270 (L) mm
Ball diameterφ100 - 450μm
Minimum ball pitch200μm
Outer dimentions3770(W) × 1250(D) × 1650(H)mm
WeightApprox.1800 kg

 

■Features

  1. Realize ball drop method lump mounting, 8 sec/1 substrate
  2. Capable to handle φ100μm ball to 450μm pitch.
  3. Realizes a large scale of jig's cost cutting compared with ball vacuum method.

 

SP-capable BGA Ball Mounting System BA-1500PP

SP-capable BGA Ball Mounting System BA-1500PP

 

■The big raise in productivity by the optimal ball array prosess

BA-1500PP is selectable between stencil printing and pin transfer for flux application. It it capable of ball mounting corresponding to every application.

 

■SPECIFICATIONS

Target components
Substrate size27-85 (W) × 150-270 (L) mm
Ball diameterφ 0.2 - φ 1.0 mm
Minimum ball pitch0.4mm

 

■Features

  1. The screen printing method with automatic positioning adjustment by image recognition is adopted. A mask cleaning unit is also provided as standard
  2. It is capable of mounting the balls with min. 0.2mm in diameter and 0.4mm ball pitches.
  3. Equip cleaning units for flux printing stencil and transfer pins as standard equipment.
  4. Realize toolless design for jig exchange.
  5. Realize both small-footprint and cost reduction.

 

12"wafer-capable Micro Ball Mounter BA-1100W

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■BM-1100W has made a lump mounting realize for 70 μm ball diameter or 12 inch wafer thanks to the first introduction of ball placement system in the field.

We have developed placement mask and placement squeegee which are effective for placement method in collaboration with Hitachi Metals., Ltd. Thanks to the development, the ratio of mounting has increased drastically, which makes lump mounting on 12 inch wafer possible.

 

■SPECIFICATIONS

Target components
Wafer size6 inch, 8 inch, 12 inch
Ball diametero70 μm to o300 μm
Minimum ball pitch150 μm (o70 μm Ball)
Outer dimentions3235(W) × 1730(D) × 1650(H)mm
WeightApprox.2500 kg

 

■Features

  1. It can correspond widely from o70 μm to usual CSP level o300 μm.
  2. Ball placement method will not cause extra balls such as it is peculiar problem to vacuum method.
  3. It realized the low cost by the jig which cost is not depending on pin mumber.
  4. The introduction of the simple structure realized the easy maintenace.
  5. BM-1110W with FOUP function is also lined up.

 

Substrate-capable Micro Ball mounter BM-750S

Substrate-capable Micro Ball mounter BM-750S

 

■o70μm ball capable microball mounter for board size substrate.

Micro ball mounting makes high quality bumping process possible, which cannot be realized by printing or plating methods, and improves final yield drastically.

 

■SPECIFICATIONS

Target components
substrate size460 × 260 mm MAX
Ball diametero70 μm to o300 μm
Minimum ball pitch150 μm (o70 μm Ball)
Outer dimentions2830(W) × 1730(D) × 1750(H) mm
WeightApprox.2300 kg

 

■Features

  1. Capable to handle CSP/BGA size substrate to 460x260mm board size substrate with conversion kit exchange.
  2. It's applicable to o70 μm with 150 μm pitch.
  3. By mounting multi-heads, high productivity similar to printing method is realized.
  4. Mass production system with inspection and repair, BM-1200S, is also lined up as in-line system.

 

Micro Ball Inspection & Repair System BM-1100WR(Wafer) / 750SR(Substrate)

Micro Ball Inspection & Repair System BM-1100WR(Wafer) / 750SR(Substrate)

 

■Certain ball repair can be executed by high speed image processing unit and newly developed repair unit.

 

■Features

BM-1100WR and 750SR will put high Speed inspection for missing ball, size error and ball shift into effect by the latest image processing unit and newly developed software and after printing individual flux, can put certain repair into effect.

 

Micro Ball Inspection & Repair System BM-1100WR(Wafer) / 750SR(Substrate)

Micro Ball Inspection & Repair System BM-1100WR(Wafer) / 750SR(Substrate)

 

■Certain ball repair can be executed by high speed image processing unit and newly developed repair unit.

 

■Features

Capable to handle CSP/BGA size substrate to 460x260mm board size substrate with conversion kit exchange.
It's applicable to o70 μm with 150 μm pitch.
By mounting multi-heads, high productivity similar to printing method is realized.
Mass production system with inspection and repair, BM-1200S, is also lined up as in-line system.

 

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