Factory automation engineering Development, design, manufacture, and marketing of high-precision mounting and assembly systems for fields such as office equipment, semiconductors, electronic parts, automobiles, and communications equipment Design, manufacture, and marketing of automation equipment.
Athlete FA Corporation was established in 1988 as a manufacturer dedicated to factory automation. Ever since then, our company has contributed to advances in factory automation for our industrial customers by fully meeting their expectations through the provision of leading-edge FA technologies.
|Name||Athlete FA Corporation|
|Exectives||Akira Yamazaki, Chairman
Susumu Yamazaki, President & CEO
|Location||2970-1 Shiga, Suwa City, Nagano 392-0012, Japan|
|Business Lines||Factory automation engineering Development, design, manufacture, and marketing of high-precision mounting and assembly systems for fields such as office equipment, semiconductors, electronic parts, automobiles, and communications equipment Design, manufacture, and marketing of automation equipment.|
|Inauguration||September 1, 1988|
|Establishment||March 1, 1989|
STATS ChipPAC Ltd
Texas Instruments Inc
|Associated company||Athlete Automation Equipment (Shanhai) co., ltd
|Banks||Hachijuni Bank (Suwa Branch)
Sumitomo Mitsui Bank (Suwa Branch)
Shoko Chukin Bank (Suwa Branch)
Nagano Bank (Suwa Branch)
Suwa Shinkin Bank (Iijima Branch)
We at Athlete FA create “Future Arts”
To promote the “Future Arts” creation we ...
We aim to become a highly trusted company responding to customers with vitally needed technologies.
Establishment of high-performance “Element Technologies.”
We strive to improve to enhance our value while broadening our horizons to perform our duties effectively and efficiently.
We, Athlete FA that is the maker who is the developer, the designer and the manufacture for Semiconductor assembling and packaging equipment and Electric component assembling equipment, will target the harmony between company activities and earth environment, will take the positive action towards the good use of natural resources and the prevention from environmental pollution and will take the social responsibility as a good corporation.
|1988||Established with paid-in capital of 20 million yen.
Camera lens assembly system launched.
|1989||Multi-die bonder (MS-3000) launched.
New corporate headquarters building and factory completed.
TAB cutting system (MS-1700) launched.
Inaugural participation in Semicon Japan trade show.
|1990||COB potting system (MS-1820) launched.
IC card test handler launched.
|1991||Twin-head TAB potting system（MS-1850T) launched.
TAB marking system（MS-1900) launched.
Eutectic die bonder launched.
Flip-chip bonder（CB-1000）sold outside for the first time in industry.
|1992||Chip bonder for communications LCD launched.
Man-machine visual interface「MAT」developed.
Cell PCB automatic soldering line (MTB-400) sold outside for the first time in industry.
|1993||ACF application system（MTB-1000）launched.|
|1994||Dual-head TAB potting system（MS-1870D）launched.
Low-cost flip-chip bonder（CB-500）developed.
|1995||Cell-PCB automatic ACF joining system (MTB-4100）launched.
Fully automated ACF flip-chip mounting line（CB-2000）launched.
Small-diameter ball mounting system（BA-1000）launched - an industry first.
|1996||Capital increased to 81.8 million yen.
Flip-chip bonder（CB-1700）geared for mass production launched.
|1997||Micro-ball mounter launched.|
afer-compatible BGA ball mounting system（BA-1100W）launched - an industry first.
|1999||3-syringe TAB potting system（MS-1880DⅢ）launched.
BGA ball mounting system with upsized head（BA-1100）launched.
Headquaters building doubled in size, clean room and truck yard added.
|2000||Company renamed Athlete FA Corporation.|
|2001||Capital increased to 85.8 million yen.
Employee Stock Ownership Society established.
COF-compatible TAB potting system（MS-1890DⅢ）awarded "Good Design Prize."
Cerficated to ISO 9001.
|2002||Ultrasonic bonding system developed.
Shaghai Office established.
Cerficated to ISO 14001.
|2003||Micro-ball mounter developed.
Overseas subsidairy Athlete Automation Equipment (Shanghai) Co.,Ltd. established.
|2005||Privately-placed bond worth 300 million yen issued.|
|2007||Microball Mounter(BM-1100)got the prize for Promoting Machine Industry hosted by Japan Society for the Promotion of Machine Industry.|
|2009||Management principle and Management policy established.|
|2010||CSP-capable Micro Ball Mounter(BM-4100) launched.
Developed ultrasonic reflow oven and exhibited at Semicon Japan show.
|2011||High speed Pick & Place system AP-1000,Pick & Place with inspection system AP-2000.|
|2013||One-piece substrate- and aggregate substrate-capable BGA/CSP ball mounter (BA-1700) launched.
Ultralow load-capable flip-chip bonder (CB-600) launched.
|2014||A series of laser-marking devices launched.|
|2015||Ag Sinter system launched.|
|2016||Improved version of CB-600 flip-chip bonders (CB-610, CB-620) launched.|
|2017||Improved version of BM-1300 micro-ball mounter (BM-1400) launched.|