Our equipment will be exhibited at Semicon China held from March 17, 2021 to March 19, 2021.
The exhibition place will be the Hall N3 3363 booth.
The equipment exhibited is Flip-chip bonder CB-600 for ultra-low load (mounting accuracy: ± 1 μm (3σ)) which supports various bonding experiments.
Please check the link below for details on Semi-Con China.
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