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enkaku
History
  • 1988

    ・Established with paid-in capital of 20 million yen.

    ・Camera lens assembly system launched.

  • 1989

    ・New corporate headquarter building and factory completed.

    ・Multi-die bonder (MS-3000) launched.

    ・TAB cutting system (MS-1700) launched.

    ・Inaugural participation in Semicon Japan trade show.

  • 1990

    ・COB potting system (MS-1820) launched.

    ・IC card test handler launched.

  • 1991

    ・Named the trademark " Athlete "

    ・Twin-head TAB potting system (MS-1850T) launched.

    ・TAB marking system (MS-1900) launched.

    ・Eutectic die bonder launched.

    ・Flip-chip bonder (CB-1000) sold outside for the first time in industry.

  • 1992

    ・Chip bonder for communications LCD launched.

    ・Man-machine visual interface "MAT" developed.

    ・Cell PCB automatic soldering line (MTB-400) sold outside
     for the first time in industry.

  • 1993

    ・ACF application system (MTB-1000) launched.

  • 1994

    ・Dual-head TAB potting system (MS-1870D) launched.

    ・Cost effective flip-chip bonder (CB-500) developed.

  • 1995

    ・Cell-PCB automatic ACF joining system (MTB-4100) launched.

    ・Fully automated ACF flip-chip mounting line (CB-2000) launched.

    ・Small-diameter ball mounting system (BA-1000) launched - an industry first.

  • 1996

    ・Capital increased to 81.8 million yen.

    ・Flip-chip bonder (CB-1700) capable of mass production launched.

  • 1997

    ・Micro-ball mounter launched.(BM-1000)

  • 1998

    ・Flip-chip bonder (CB-1750) launched.

    ・BGA ball mounting system (BA-1100W) launched - an industry first.

  • 1999

    ・3-syringe TAB potting system (MS-1880DⅢ) launched.

    ・BGA ball mounting system with upsized head (BA-1100) launched.

    ・Headquarter building doubled in size, clean room and truck yard added.

  • 2000

    ・Company renamed as Athlete FA Corporation.

    ・Private-placement bonds of 20 million yen issued.

  • 2001

    ・Capital increased to 85.8 million yen.

    ・Employee Stock Ownership Society established.

    ・COF-compatible TAB potting system (MS-1890DⅢ) awarded
     " Good Design Prize. "

    ・Certified to ISO 9001.

  • 2002

    ・Ultrasonic bonding system developed.

    ・Shanghai Office established.

    ・Certified to ISO 14001.

  • 2003

    ・Micro-ball mounter developed. (BM-1100)

    ・Overseas subsidiary
     Athlete Automation Equipment (Shanghai) Co.,Ltd. established.

  • 2005

    ・Privately-placed bond worth 300 million yen issued.

  • 2007

    ・Microball Mounter (BM-1100) got the prize for Promoting Machine Industry
     hosted by Japan Society for the Promotion of Machine Industry.

  • 2008

    ・Certified to ISO 9001 and 14001.

  • 2009

    ・Management principle and Management policy established.

  • 2010

    ・CSP-capable Micro Ball Mounter (BM-4100) launched.

    ・Developed ultrasonic reflow oven and exhibited at Semicon Japan show.

  • 2011

    ・High speed Pick & Place system AP-1000,
     Pick & Place with inspection system AP-2000.

    ・BM-1100 improved microball mounter (BM-1300) launched.

  • 2013

    ・One-piece substrate- and aggregate substrate-capable BGA/CSP ball mounter
     (BA-1700) launched.

    ・Ultralow load-capable flip-chip bonder (CB-600) launched.

  • 2014

    ・A series of laser-marking devices launched.

  • 2015

    ・Ag Sinter system launched.

  • 2016

    ・Improved version of CB-600 flip-chip bonders (CB-610, CB-620) launched.

  • 2018

    ・Improved version of BM-1300 micro-ball mounter (BM-1400) launched.

    ・Desktop flip chip bonder (CB-200) launched.

  • 2019

    ・Company building extension work completed.

    ・CoS Bonder (CBZ-1000) launched.