・Established with paid-in capital of 20 million yen.
・Camera lens assembly system launched.
・New corporate headquarter building and factory completed.
・Multi-die bonder (MS-3000) launched.
・TAB cutting system (MS-1700) launched.
・Inaugural participation in Semicon Japan trade show.
・COB potting system (MS-1820) launched.
・IC card test handler launched.
・Named the trademark " Athlete "
・Twin-head TAB potting system (MS-1850T) launched.
・TAB marking system (MS-1900) launched.
・Eutectic die bonder launched.
・Flip-chip bonder (CB-1000) sold outside for the first time in industry.
・Chip bonder for communications LCD launched.
・Man-machine visual interface "MAT" developed.
・Cell PCB automatic soldering line (MTB-400) sold outside
for the first time in industry.
・ACF application system (MTB-1000) launched.
・Dual-head TAB potting system (MS-1870D) launched.
・Cost effective flip-chip bonder (CB-500) developed.
・Cell-PCB automatic ACF joining system (MTB-4100) launched.
・Fully automated ACF flip-chip mounting line (CB-2000) launched.
・Small-diameter ball mounting system (BA-1000) launched - an industry first.
・Capital increased to 81.8 million yen.
・Flip-chip bonder (CB-1700) capable of mass production launched.
・Micro-ball mounter launched.(BM-1000)
・Flip-chip bonder (CB-1750) launched.
・BGA ball mounting system (BA-1100W) launched - an industry first.
・3-syringe TAB potting system (MS-1880DⅢ) launched.
・BGA ball mounting system with upsized head (BA-1100) launched.
・Headquarter building doubled in size, clean room and truck yard added.
・Company renamed as Athlete FA Corporation.
・Private-placement bonds of 20 million yen issued.
・Capital increased to 85.8 million yen.
・Employee Stock Ownership Society established.
・COF-compatible TAB potting system (MS-1890DⅢ) awarded
" Good Design Prize. "
・Certified to ISO 9001.
・Ultrasonic bonding system developed.
・Shanghai Office established.
・Certified to ISO 14001.
・Micro-ball mounter developed. (BM-1100)
Athlete Automation Equipment (Shanghai) Co.,Ltd. established.
・Privately-placed bond worth 300 million yen issued.
・Microball Mounter (BM-1100) got the prize for Promoting Machine Industry
hosted by Japan Society for the Promotion of Machine Industry.
・Certified to ISO 9001 and 14001.
・Management principle and Management policy established.
・CSP-capable Micro Ball Mounter (BM-4100) launched.
・Developed ultrasonic reflow oven and exhibited at Semicon Japan show.
・High speed Pick & Place system AP-1000,
Pick & Place with inspection system AP-2000.
・BM-1100 improved microball mounter (BM-1300) launched.
・One-piece substrate- and aggregate substrate-capable BGA/CSP ball mounter
・Ultralow load-capable flip-chip bonder (CB-600) launched.
・A series of laser-marking devices launched.
・Ag Sinter system launched.
・Improved version of CB-600 flip-chip bonders (CB-610, CB-620) launched.
・Improved version of BM-1300 micro-ball mounter (BM-1400) launched.
・Desktop flip chip bonder (CB-200) launched.
・Company building extension work completed.
・CoS Bonder (CBZ-1000) launched.
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